Købe LT1371ISW#TRPBF med BYCHPS
Køb med garanti
LT1371ISW#TRPBF
- Varenummer:
- LT1371ISW#TRPBF
- Fabrikant:
- L
- Beskrivelse:
- IC REG MULT CONFG INV ADJ 20SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18705 Pieces
- Datablad:
- LT1371ISW#TRPBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LT1371ISW#TRPBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LT1371ISW#TRPBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Output (Min / Fast): | 1.245V |
|---|---|
| Spænding - Udgang (Max): | 35V (Switch) |
| Spænding - Indgang (Min): | 2.7V |
| Spænding - Indgang (Max): | 30V |
| Topologi: | Buck, Boost, Cuk, Flyback, Forward Converter, SEPIC |
| Synkron-ensretter: | No |
| Leverandør Device Package: | 20-SOIC |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 20-SOIC (0.295", 7.50mm Width) |
| Output Type: | Adjustable |
| Output Configuration: | Positive or Negative |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antal udgange: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | LT1371ISW#TRPBF |
| Fungere: | Step-Up, Step-Down, Step-Up/Step-Down |
| Frequency - Switching: | 500kHz |
| Udvidet beskrivelse: | Buck, Boost, Cuk, Flyback, Forward Converter, SEPIC Switching Regulator IC Positive or Negative Adjustable 1.245V 1 Output 3A (Switch) 20-SOIC (0.295", 7.50mm Width) |
| Beskrivelse: | IC REG MULT CONFG INV ADJ 20SOIC |
| Nuværende - Output: | 3A (Switch) |
| Email: | [email protected] |
Relaterede dele til LT1371ISW#TRPBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog