Købe LT6700HVCS6-3#TRPBF med BYCHPS
Køb med garanti
LT6700HVCS6-3#TRPBF
- Varenummer:
- LT6700HVCS6-3#TRPBF
- Fabrikant:
- L
- Beskrivelse:
- IC COMP DUAL 400MV REF TSOT23-6
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17204 Pieces
- Datablad:
- LT6700HVCS6-3#TRPBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LT6700HVCS6-3#TRPBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LT6700HVCS6-3#TRPBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | 1.4 V ~ 18 V |
|---|---|
| Spænding - Indgangsforskydning (Max): | - |
| Type: | with Voltage Reference |
| Leverandør Device Package: | TSOT-23-6 |
| Serie: | Over-The-Top® |
| Forplantningsforsinkelse (Max): | 29µs |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SOT-23-6 Thin, TSOT-23-6 |
| Output Type: | Open Collector |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal elementer: | 2 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | LT6700HVCS6-3#TRPBF |
| Hysterese: | 11mV |
| Udvidet beskrivelse: | Comparator with Voltage Reference Open Collector TSOT-23-6 |
| Beskrivelse: | IC COMP DUAL 400MV REF TSOT23-6 |
| Nuværende - Quiescent (Max): | 16µA |
| Nuværende - Output (Typ): | - |
| Nuværende - Input Bias (Max): | 0.01µA @ 18V |
| CMRR, PSRR (Typ): | - |
| Email: | [email protected] |
Relaterede dele til LT6700HVCS6-3#TRPBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers