Købe LWK212BJ475KD-T med BYCHPS
Køb med garanti
LWK212BJ475KD-T
- Varenummer:
- LWK212BJ475KD-T
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- CAP CER 4.7UF 10V X5R 0508
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16112 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for LWK212BJ475KD-T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LWK212BJ475KD-T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 10V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.037" (0.95mm) |
| Temperaturkoefficient: | X5R |
| Størrelse / Dimension: | 0.049" L x 0.079" W (1.25mm x 2.00mm) |
| Serie: | LWK |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0508 (1220 Metric) |
| Andre navne: | 587-3112-2 CE LWK212 BJ475KD-T LWK212BJ475KDT |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | LWK212BJ475KD-T |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Low ESL (Reverse Geometry) |
| Udvidet beskrivelse: | 4.7µF ±10% 10V Ceramic Capacitor X5R 0508 (1220 Metric) |
| Beskrivelse: | CAP CER 4.7UF 10V X5R 0508 |
| kapacitans: | 4.7µF |
| Applikationer: | Bypass, Decoupling |
| Email: | [email protected] |
Relaterede dele til LWK212BJ475KD-T
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
LWK212BJ475MDHT | Taiyo Yuden | CAP CER 4.7UF 10V X5R 0508 | Forespørgsel |
|
LWK212C6106MD-T | Taiyo Yuden | CAP CER 10UF 10V X6S 0508 | Forespørgsel |
|
LWK212BJ475KDHT | Taiyo Yuden | CAP CER 4.7UF 10V X5R 0508 | Forespørgsel |
|
LWK212BJ106MD-T | Taiyo Yuden | CAP CER 10UF 10V X5R 0508 | Forespørgsel |
|
LWK212BJ475MD-T | Taiyo Yuden | CAP CER 4.7UF 10V X5R 0508 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers