Købe M29DW256G70NF6F TR med BYCHPS
Køb med garanti
M29DW256G70NF6F TR
- Varenummer:
- M29DW256G70NF6F TR
- Fabrikant:
- Micron Technology
- Beskrivelse:
- IC FLASH 256MBIT 70NS 56TSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16118 Pieces
- Datablad:
- M29DW256G70NF6F TR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for M29DW256G70NF6F TR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til M29DW256G70NF6F TR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 56-TSOP (14x20) |
| Fart: | 70ns |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 56-TFSOP (0.724", 18.40mm Width) |
| Andre navne: | M29DW256G70NF6F M29DW256G70NF6FTR M29DW256G70NF6FTR-ND |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 256Mb (16M x 16) |
| Hukommelsesformat: | FLASH |
| Producentens varenummer: | M29DW256G70NF6F TR |
| grænseflade: | Parallel |
| Beskrivelse: | IC FLASH 256MBIT 70NS 56TSOP |
| Email: | [email protected] |
Relaterede dele til M29DW256G70NF6F TR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
M29DW256G70ZA6F TR | Micron Technology Inc. | IC FLASH 256MBIT 70NS 64TBGA | Forespørgsel |
 |
M29DW256G70NF6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Forespørgsel |
 |
M29DW256G7ANF6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Forespørgsel |
|
M29DW256G70ZA6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 64TBGA | Forespørgsel |
|
M29DW256G7ANF6F TR | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Forespørgsel |
|
M29DW256G70NF3E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog