Købe M5475AFE med BYCHPS
Køb med garanti
M5475AFE
- Varenummer:
- M5475AFE
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- MODULE FIRE ENGINE
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16587 Pieces
- Datablad:
- M5475AFE.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for M5475AFE, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til M5475AFE via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Fart: | 266MHz |
|---|---|
| Størrelse / Dimension: | 3.7" x 4.5" (93.4mm x 114.3mm) |
| Serie: | ColdFire® |
| RAM-størrelse: | 64MB |
| Driftstemperatur: | 0°C ~ 70°C |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Modul / Board Type: | MPU Core |
| Producentens varenummer: | M5475AFE |
| Flash størrelse: | 2MB (Boot) |
| Udvidet beskrivelse: | ColdFire® Embedded Module ColdFire V4e, MCF5475 266MHz 64MB 2MB (Boot) |
| Beskrivelse: | MODULE FIRE ENGINE |
| Core Processor: | ColdFire V4e, MCF5475 |
| Tilslutningstype: | - |
| Co-processor: | - |
| Email: | [email protected] |
Relaterede dele til M5475AFE
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FS-3008 | Digi International | MODULE 32MB SDRAM 32MB FLASH | Forespørgsel |
 |
M5475BFE | NXP USA Inc. | MODULE FIRE ENGINE | Forespørgsel |
|
CC-9P-V225-Z1 | Digi International | CONNECTCORE | Forespørgsel |
 |
SOMXC6748-10-1602AHCR | Logic | SYSTEM ON MODULE LV TMS320C6748 | Forespørgsel |
|
M5475DFE | NXP USA Inc. | MODULE FIRE ENGINE | Forespørgsel |
|
M5475EFE | NXP USA Inc. | MODULE FIRE ENGINE | Forespørgsel |
|
M5475CFE | NXP USA Inc. | MODULE FIRE ENGINE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers