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M58BW32FB5ZA3T TR
- Varenummer:
- M58BW32FB5ZA3T TR
- Fabrikant:
- Micron Technology
- Beskrivelse:
- IC FLASH 32MBIT 55NS LBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12852 Pieces
- Datablad:
- M58BW32FB5ZA3T TR.pdf
Introduktion
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specifikationer
| Spænding - Forsyning: | 2.5 V ~ 3.3 V |
|---|---|
| Leverandør Device Package: | 80-LBGA (10x12) |
| Fart: | 55ns |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 80-LBGA |
| Andre navne: | M58BW32FB5ZA3T |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 32Mb (1M x 32) |
| Hukommelsesformat: | FLASH |
| Producentens varenummer: | M58BW32FB5ZA3T TR |
| grænseflade: | Parallel |
| Beskrivelse: | IC FLASH 32MBIT 55NS LBGA |
| Email: | [email protected] |
Relaterede dele til M58BW32FB5ZA3T TR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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M58BW32FB5T3T TR | Micron Technology Inc. | IC FLASH 32MBIT 55NS 80QFP | Forespørgsel |
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M58BW32FB4D150 | Micron Technology Inc. | SLC 32M DIE 4MX8 | Forespørgsel |
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M58BW016FB7D150T TR | Micron Technology Inc. | IC FLASH 16MBIT 70NS DIE | Forespørgsel |
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M58BW16FB5ZA3F | Micron Technology Inc. | IC FLASH 16BIT 80LBGA | Forespørgsel |
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M58BW32FB5T3F TR | Micron Technology Inc. | IC FLASH 32MBIT 55NS 80QFP | Forespørgsel |
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M58BW016FB7T3T TR | Micron Technology Inc. | IC FLASH 16MBIT 70NS 80QFP | Forespørgsel |
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M58BW32FT4D150 | Micron Technology Inc. | SLC 32M DIE 4MX8 | Forespørgsel |
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M58BW32FB4T3T TR | Micron Technology Inc. | IC FLASH 32MBIT 45NS 80QFP | Forespørgsel |
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M58BW16FB5T3T TR | Micron Technology Inc. | IC FLASH 16MBIT 55NS 80QFP | Forespørgsel |
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M58BW16FB4ZA3F TR | Micron Technology Inc. | IC FLASH 16MBIT 45NS 80LBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers