Købe MAL219691105E3 med BYCHPS
Køb med garanti
MAL219691105E3
- Varenummer:
- MAL219691105E3
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP ALUM 4F 7.0V SNAP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19989 Pieces
- Datablad:
- MAL219691105E3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAL219691105E3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAL219691105E3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 7V |
|---|---|
| Tolerance: | -20%, +80% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.276" Dia (7.00mm) |
| Serie: | ENYCAP™ 196HVC |
| Emballage: | Tray |
| Pakke / tilfælde: | Coin, Stacked Vertical |
| Driftstemperatur: | -20°C ~ 70°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 25 Weeks |
| Producentens varenummer: | MAL219691105E3 |
| Levetid @ Temp.: | 1000 Hrs @ 85°C |
| Blyafstand: | 0.295" (7.50mm) |
| Højde - Siddende (Max): | 0.492" (12.50mm) |
| Udvidet beskrivelse: | 4F -20%, +80%(EDLC) Supercapacitor 7V Coin, Stacked Vertical 12.5 Ohm @ 1kHz 1000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 12.5 Ohm @ 1kHz |
| Beskrivelse: | CAP ALUM 4F 7.0V SNAP |
| kapacitans: | 4F |
| Email: | [email protected] |
Relaterede dele til MAL219691105E3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers