Købe MAL804324061E3 med BYCHPS
Køb med garanti
MAL804324061E3
- Varenummer:
- MAL804324061E3
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- MNT BRACKET FOR ROUND CAN TYPES
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18532 Pieces
- Datablad:
- MAL804324061E3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAL804324061E3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAL804324061E3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| specifikationer: | Screw Clamp Type Bracket |
|---|---|
| Serie: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | MAL804324061E3 |
| Til brug med / relaterede produkter: | Round Can Types |
| Enhedsstørrelse: | 2.559" Dia (65.0mm) |
| Beskrivelse: | MNT BRACKET FOR ROUND CAN TYPES |
| Tilbehørstype: | Mounting Bracket |
| Email: | [email protected] |
Relaterede dele til MAL804324061E3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MAL804324051E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804324021E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804324031E3 | Vishay BC Components | MNT BRACKETP FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804320381E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Forespørgsel |
|
MAL804324011E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804324041E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804323321E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
|
MAL804320391E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Forespørgsel |
|
MAL804324921E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog