Købe MAT03EH med BYCHPS
Køb med garanti
MAT03EH
- Varenummer:
- MAT03EH
- Fabrikant:
- AD
- Beskrivelse:
- TRANS 2PNP 36V 0.02A TO78-6
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 19059 Pieces
- Datablad:
- MAT03EH.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAT03EH, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAT03EH via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 36V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 100mV @ 100µA, 1mA |
| Transistor Type: | 2 PNP (Dual) |
| Leverandør Device Package: | TO-78-6 |
| Serie: | - |
| Strøm - Max: | 500mW |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-78-6 Metal Can |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MAT03EH |
| Frekvens - Overgang: | 190MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor Array 2 PNP (Dual) 36V 20mA 190MHz 500mW Through Hole TO-78-6 |
| Beskrivelse: | TRANS 2PNP 36V 0.02A TO78-6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | - |
| Nuværende - Collector Cutoff (Max): | - |
| Nuværende - Samler (Ic) (Max): | 20mA |
| Email: | [email protected] |
Relaterede dele til MAT03EH
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MAT03FHZ | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Forespørgsel |
 |
STA460C | Sanken | TRANS 2NPN DARL 60V 6A | Forespørgsel |
 |
XP0250100L | Panasonic Electronic Components | TRANS 2NPN 50V 0.1A SMINI5 | Forespørgsel |
|
MAT03FH | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Forespørgsel |
|
MAT03EHZ | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Forespørgsel |
 |
ZDT6753TA | Diodes Incorporated | TRANS NPN/PNP 100V 2A SM8 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers