Købe MBRD330 med BYCHPS
Køb med garanti
MBRD330
- Varenummer:
- MBRD330
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE SCHOTTKY 30V 3A DPAK
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16913 Pieces
- Datablad:
- MBRD330.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MBRD330, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MBRD330 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 600mV @ 3A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 30V |
| Leverandør Device Package: | D-Pak |
| Fart: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navne: | *MBRD330 VS-MBRD330 VS-MBRD330-ND VSMBRD330 VSMBRD330-ND |
| Driftstemperatur - Junction: | -40°C ~ 150°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MBRD330 |
| Udvidet beskrivelse: | Diode Schottky 30V 3A Surface Mount D-Pak |
| Diodetype: | Schottky |
| Beskrivelse: | DIODE SCHOTTKY 30V 3A DPAK |
| Nuværende - Reverse Lækage @ Vr: | 200µA @ 30V |
| Nuværende - Gennemsnitlig Rectified (Io): | 3A |
| Kapacitans @ Vr, F: | - |
| Email: | [email protected] |
Relaterede dele til MBRD330
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers