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MC14490FELG
- Varenummer:
- MC14490FELG
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC BOUNCE ELIMINATOR 16SOEIAJ
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17020 Pieces
- Datablad:
- MC14490FELG.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MC14490FELG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MC14490FELG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 3 V ~ 18 V |
|---|---|
| Leverandør Device Package: | 16-SOEIAJ |
| Serie: | 4000 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 16-SOIC (0.209", 5.30mm Width) |
| Andre navne: | MC14490FELG-ND MC14490FELGOSTR |
| Driftstemperatur: | -55°C ~ 125°C |
| Antal bitter: | 6 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | MC14490FELG |
| Logik Type: | Contact Bounce Eliminator |
| Udvidet beskrivelse: | Contact Bounce Eliminator IC 16-SOEIAJ |
| Beskrivelse: | IC BOUNCE ELIMINATOR 16SOEIAJ |
| Email: | [email protected] |
Relaterede dele til MC14490FELG
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MC14490FG | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørgsel |
 |
MC14490PG | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16DIP | Forespørgsel |
|
MC14490DWG | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16SOIC | Forespørgsel |
|
MC14490DWR2G | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16-SOIC | Forespørgsel |
|
MC14490DWR2 | ON Semiconductor | IC ELIMINATOR BOUNCE HEX 16-SOIC | Forespørgsel |
|
MC14490F | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørgsel |
|
MC14490FEL | ON Semiconductor | IC BOUNCE ELIMINATOR 16SOEIAJ | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers