Købe MC25XS6300EK med BYCHPS
Køb med garanti
MC25XS6300EK
- Varenummer:
- MC25XS6300EK
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC SWITCH HIGH SIDE 32SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17090 Pieces
- Datablad:
- MC25XS6300EK.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MC25XS6300EK, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MC25XS6300EK via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 4.5 V ~ 5.5 V |
|---|---|
| Spænding - Belastning: | 7 V ~ 18 V |
| Switch Type: | General Purpose |
| Leverandør Device Package: | 32-SOIC EP |
| Serie: | - |
| Rds On (Typ): | 25 mOhm |
| Forhold - Indgang: Output: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
| Output Type: | - |
| Output Configuration: | High Side |
| Andre navne: | 934070517574 |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antal udgange: | 4 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | MC25XS6300EK |
| grænseflade: | SPI |
| Input Type: | - |
| Funktioner: | Status Flag |
| Fejlbeskyttelse: | Open Load Detect, Over Temperature |
| Beskrivelse: | IC SWITCH HIGH SIDE 32SOIC |
| Nuværende - Output (Max): | 3.8A |
| Email: | [email protected] |
Relaterede dele til MC25XS6300EK
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers