Købe MCP2022P-330E/ST med BYCHPS
Køb med garanti
MCP2022P-330E/ST
- Varenummer:
- MCP2022P-330E/ST
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC TXRX LIN ON-BOARD VREG 14TSSO
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19918 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for MCP2022P-330E/ST, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MCP2022P-330E/ST via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 6 V ~ 18 V |
|---|---|
| Type: | Transceiver |
| Leverandør Device Package: | 14-TSSOP |
| Serie: | - |
| Modtager Hysterese: | 175mV |
| protokol: | LIN |
| Emballage: | Tube |
| Pakke / tilfælde: | 14-TSSOP (0.173", 4.40mm Width) |
| Driftstemperatur: | -40°C ~ 125°C |
| Antal drivere / modtagere: | 1/1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | MCP2022P-330E/ST |
| Udvidet beskrivelse: | 1/1 Transceiver Half LIN 14-TSSOP |
| Duplex: | Half |
| Beskrivelse: | IC TXRX LIN ON-BOARD VREG 14TSSO |
| Datahastighed: | - |
| Email: | [email protected] |
Relaterede dele til MCP2022P-330E/ST
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers