Købe MCP9600-I/MX med BYCHPS
Køb med garanti
MCP9600-I/MX
- Varenummer:
- MCP9600-I/MX
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC THRMOCPLE TO DIG CONV 20MQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19834 Pieces
- Datablad:
- MCP9600-I/MX.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MCP9600-I/MX, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MCP9600-I/MX via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Thermocouple to Digital Converter |
|---|---|
| Leverandør Device Package: | 20-MQFN (5x5) |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 20-VQFN Exposed Pad |
| Output Type: | Digital |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | MCP9600-I/MX |
| grænseflade: | I²C |
| Input Type: | Thermocouple |
| Beskrivelse: | IC THRMOCPLE TO DIG CONV 20MQFN |
| Nuværende - Forsyning: | 300µA |
| Email: | [email protected] |
Relaterede dele til MCP9600-I/MX
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MCP9600T-E/MX | Microchip Technology | IC THERMOCOUPLE TO I2C 20MQFN | Forespørgsel |
 |
RE46C104E14F | Microchip Technology | IC HORN DRIVER DUAL 14DIP | Forespørgsel |
|
MCP9600T-I/MX | Microchip Technology | IC THRMOCPLE TO DIG CONV 20MQFN | Forespørgsel |
|
MCP9600-E/MX | Microchip Technology | IC THERMOCOUPLE TO I2C 20MQFN | Forespørgsel |
 |
SX8725CWLTDT | Semtech Corporation | IC DAS ADC 16BIT I2C/SRL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers