Købe MDI550-12A4 med BYCHPS
Køb med garanti
MDI550-12A4
- Varenummer:
- MDI550-12A4
- Fabrikant:
- IXYS Corporation
- Beskrivelse:
- MOD IGBT BUCK 1200V 670A Y3-DCB
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13494 Pieces
- Datablad:
- MDI550-12A4.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MDI550-12A4, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MDI550-12A4 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.8V @ 15V, 400A |
| Leverandør Device Package: | Y3-DCB |
| Serie: | - |
| Strøm - Max: | 2750W |
| Pakke / tilfælde: | Y3-DCB |
| Driftstemperatur: | 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | MDI550-12A4 |
| Inputkapacitans (Cies) @ Vce: | 26nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Udvidet beskrivelse: | IGBT Module NPT Single 1200V 670A 2750W Chassis Mount Y3-DCB |
| Beskrivelse: | MOD IGBT BUCK 1200V 670A Y3-DCB |
| Nuværende - Collector Cutoff (Max): | 21mA |
| Nuværende - Samler (Ic) (Max): | 670A |
| Konfiguration: | Single |
| Email: | [email protected] |
Relaterede dele til MDI550-12A4
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
APTGF15H120T3G | Microsemi Corporation | IGBT MODULE NPT FULL BRIDGE SP3 | Forespørgsel |
 |
MII300-12A4 | IXYS | MOD IGBT RBSOA 1200V 330A Y3-DCB | Forespørgsel |
|
APTGT300TL65G | Microsemi Corporation | IGBT 650V SP6C | Forespørgsel |
 |
IXGN72N60C3H1 | IXYS | IGBT 78A 600V SOT-227B | Forespørgsel |
|
IXGN120N60A3 | IXYS | IGBT 200A 600V SOT-227B | Forespørgsel |
|
MWI30-12E6K | IXYS | MOD IGBT SIXPACK RBSOA 1200V E1 | Forespørgsel |
|
VII75-06P1 | IXYS | MOD IGBT PHASE LEG 600V ECOPAC2 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog