Købe MKI75-12E8 med BYCHPS
Køb med garanti
MKI75-12E8
- Varenummer:
- MKI75-12E8
- Fabrikant:
- IXYS Corporation
- Beskrivelse:
- MOD IGBT H-BRIDGE 1200V 130A E3
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17037 Pieces
- Datablad:
- MKI75-12E8.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MKI75-12E8, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MKI75-12E8 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.5V @ 15V, 75A |
| Leverandør Device Package: | E3 |
| Serie: | - |
| Strøm - Max: | 500W |
| Pakke / tilfælde: | E3 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MKI75-12E8 |
| Inputkapacitans (Cies) @ Vce: | 5.7nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Udvidet beskrivelse: | IGBT Module NPT Full Bridge Inverter 1200V 130A 500W Chassis Mount E3 |
| Beskrivelse: | MOD IGBT H-BRIDGE 1200V 130A E3 |
| Nuværende - Collector Cutoff (Max): | 1.1mA |
| Nuværende - Samler (Ic) (Max): | 130A |
| Konfiguration: | Full Bridge Inverter |
| Email: | [email protected] |
Relaterede dele til MKI75-12E8
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
APTGF150SK120TG | Microsemi Corporation | IGBT 1200V 200A 961W SP4 | Forespørgsel |
 |
MWI60-06G6K | IXYS | MOD IGBT SIX-PACK RBSOA E1 | Forespørgsel |
|
APTGT100H170G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP6 | Forespørgsel |
|
MKI75-06A7T | IXYS | IGBT H-BRIDGE 600V E2PACK | Forespørgsel |
|
MKI75-06A7 | IXYS | MOD IGBT H-BRIDGE 600V 90A E2 | Forespørgsel |
 |
CM400HA-34H | Powerex Inc. | IGBT MOD SGL 1700V 400A H SER | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers