Købe MKP1848C62250JP4 med BYCHPS
Køb med garanti
MKP1848C62250JP4
- Varenummer:
- MKP1848C62250JP4
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 22UF 5% 500VDC RAD 4LD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19213 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for MKP1848C62250JP4, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MKP1848C62250JP4 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 500V |
|---|---|
| Spændingsbedømmelse - AC: | - |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 1.693" L x 0.846" W (43.00mm x 21.50mm) |
| Serie: | MKP1848C |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial - 4 Leads |
| Andre navne: | 1848C62250JP4 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | MKP1848C62250JP4 |
| Blyafstand: | 1.476" (37.50mm) |
| Højde - Siddende (Max): | 1.516" (38.50mm) |
| Funktioner: | Low ESR; Low ESL; Long Life |
| Udvidet beskrivelse: | 22µF ±5% Film Capacitor 500V Polypropylene (PP), Metallized Radial - 4 Leads |
| ESR (Equivalent Series Resistance): | 7 mOhm |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 22UF 5% 500VDC RAD 4LD |
| kapacitans: | 22µF |
| Applikationer: | DC Link, DC Filtering |
| Email: | [email protected] |
Relaterede dele til MKP1848C62250JP4
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers