Købe MMBFU310LT1G med BYCHPS
Køb med garanti
MMBFU310LT1G
- Varenummer:
- MMBFU310LT1G
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- JFET N-CH 25V 0.225W SOT23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15845 Pieces
- Datablad:
- MMBFU310LT1G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MMBFU310LT1G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MMBFU310LT1G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Cutoff (VGS off) @ Id: | 2.5V @ 1nA |
|---|---|
| Spænding - Opdeling (V (BR) GSS): | 25V |
| Leverandør Device Package: | SOT-23-3 (TO-236) |
| Serie: | - |
| Modstand - RDS (Til): | - |
| Strøm - Max: | 225mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | MMBFU310LT1GOS MMBFU310LT1GOS-ND MMBFU310LT1GOSTR |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 2 Weeks |
| Producentens varenummer: | MMBFU310LT1G |
| Inputkapacitans (Ciss) (Max) @ Vds: | 5pF @ 10V (VGS) |
| FET Type: | N-Channel |
| Udvidet beskrivelse: | JFET N-Channel 24mA @ 10V 225mW Surface Mount SOT-23-3 (TO-236) |
| Afløb til Source Voltage (VDSS): | 25V |
| Beskrivelse: | JFET N-CH 25V 0.225W SOT23 |
| Nuværende - Afløb (Idss) @ Vds (Vgs = 0): | 24mA @ 10V |
| Email: | [email protected] |
Relaterede dele til MMBFU310LT1G
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MMBFU310LT1 | ON Semiconductor | JFET N-CH 25V 0.225W SOT23 | Forespørgsel |
 |
2N5116JTXL02 | Vishay Siliconix | JFET P-CH 30V TO-18 | Forespørgsel |
 |
PMBFJ110,215 | NXP USA Inc. | JFET N-CH 25V 250MW SOT23 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers