Købe MRFE6VP61K25HR6 med BYCHPS
Køb med garanti
MRFE6VP61K25HR6
- Varenummer:
- MRFE6VP61K25HR6
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- FET RF 2CH 133V 230MHZ NI-1230
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14310 Pieces
- Datablad:
- MRFE6VP61K25HR6.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MRFE6VP61K25HR6, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MRFE6VP61K25HR6 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Test: | 50V |
|---|---|
| Spændingsvurdering: | 133V |
| Transistor Type: | LDMOS (Dual) |
| Leverandør Device Package: | NI-1230 |
| Serie: | - |
| Power - Output: | 1250W |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | NI-1230 |
| Andre navne: | MRFE6VP61K25HR6DKR |
| Støj figur: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | MRFE6VP61K25HR6 |
| Gevinst: | 24dB |
| Frekvens: | 230MHz |
| Udvidet beskrivelse: | RF Mosfet LDMOS (Dual) 50V 100mA 230MHz 24dB 1250W NI-1230 |
| Beskrivelse: | FET RF 2CH 133V 230MHZ NI-1230 |
| Nuværende vurdering: | - |
| Nuværende - Test: | 100mA |
| Email: | [email protected] |
Relaterede dele til MRFE6VP61K25HR6
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MRFE6VP61K25HSR5 | NXP USA Inc. | FET RF 2CH 133V 230MHZ NI-1230S | Forespørgsel |
 |
MRFE6VP61K25GNR6 | NXP USA Inc. | TRANS RF LDMOS 1250W 50V | Forespørgsel |
 |
MRFE6VP61K25GSR5 | NXP USA Inc. | FET RF 2CH 133V 230MHZ NI1230GS | Forespørgsel |
 |
MRFE6VP61K25HR5 | NXP USA Inc. | FET RF 2CH 133V 230MHZ NI-1230 | Forespørgsel |
|
MRFE6VP61K25NR6 | NXP USA Inc. | TRANS RF LDMOS 1250W 50V | Forespørgsel |
|
MRFE6VP61K25HSR6 | NXP USA Inc. | FET RF 2CH 133V 230MHZ NI-1230S | Forespørgsel |
|
MRFE6VP6600GNR3 | NXP USA Inc. | TRANS RF LDMOS 600W 50V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers