Købe MS1336 med BYCHPS
Køb med garanti
MS1336
- Varenummer:
- MS1336
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 70W 8A M135
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14043 Pieces
- Datablad:
- MS1336.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MS1336, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MS1336 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 18V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | M135 |
| Serie: | - |
| Strøm - Max: | 70W |
| Emballage: | Bulk |
| Pakke / tilfælde: | M135 |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis, Stud Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MS1336 |
| Gevinst: | 10dB |
| Frekvens - Overgang: | 175MHz |
| Udvidet beskrivelse: | RF Transistor NPN 18V 8A 175MHz 70W Chassis, Stud Mount M135 |
| Beskrivelse: | TRANS RF BIPO 70W 8A M135 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 250mA, 5V |
| Nuværende - Samler (Ic) (Max): | 8A |
| Email: | [email protected] |
Relaterede dele til MS1336
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2N5031 | Microsemi Corporation | TRANS RF NPN 200MW 20MA TO72 | Forespørgsel |
 |
AT-32032-TR2G | Broadcom Limited | TRANS NPN BIPO 5.5V 30MA SOT-323 | Forespørgsel |
 |
MRF5812GR2 | Microsemi Corporation | TRANS NPN 15V 200MA 8-SOIC | Forespørgsel |
|
10A030 | Microsemi Corporation | TRANS RF BIPO 13W 1.5A 55FT2 | Forespørgsel |
|
MS1337 | Microsemi Corporation | TRANS RF BIPO 70W 8A M113 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog