Købe NLV14053BDTR2G med BYCHPS
Køb med garanti
NLV14053BDTR2G
- Varenummer:
- NLV14053BDTR2G
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC MUX/DEMUX TRIPLE 2CH 16-TSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18869 Pieces
- Datablad:
- NLV14053BDTR2G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NLV14053BDTR2G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NLV14053BDTR2G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Single (V +): | 3 V ~ 18 V |
|---|---|
| Spænding - Supply, Dual (V ±): | - |
| Skift tid (Ton, Toff) (Max): | - |
| Skift kredsløb: | SPDT |
| Leverandør Device Package: | 16-TSSOP |
| Serie: | Automotive, AEC-Q100 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 16-TSSOP (0.173", 4.40mm Width) |
| Driftstemperatur: | -55°C ~ 125°C (TA) |
| On-State Resistance (Max): | 280 Ohm |
| Antal kredsløb: | 3 |
| Multiplexer / Demultiplexer Circuit: | 2:1 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | NLV14053BDTR2G |
| Udvidet beskrivelse: | 3 Circuit IC Switch 2:1 280 Ohm 16-TSSOP |
| Beskrivelse: | IC MUX/DEMUX TRIPLE 2CH 16-TSSOP |
| Nuværende - Lækage (IS (slukket)) (Max): | 100nA |
| crosstalk: | - |
| Charge Injection: | - |
| Kanal til kanal matching (ΔRon): | 10 Ohm |
| Kanalkapacitans (CS (slukket), CD (slukket)): | 7.5pF |
| -3db båndbredde: | 17MHz |
| Email: | [email protected] |
Relaterede dele til NLV14053BDTR2G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers