Købe NOJX157M002RWJ med BYCHPS
Køb med garanti
NOJX157M002RWJ
- Varenummer:
- NOJX157M002RWJ
- Fabrikant:
- AVX Corporation
- Beskrivelse:
- CAP NIOB OXI 150UF 20% 2.5V 2917
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15299 Pieces
- Datablad:
- NOJX157M002RWJ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NOJX157M002RWJ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NOJX157M002RWJ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.5V |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 2917 (7343 Metric) |
| Størrelse / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Serie: | OxiCap® NOJ |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2917 (7343 Metric) |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens størrelse Kode: | X |
| Producentens varenummer: | NOJX157M002RWJ |
| Højde - Siddende (Max): | 0.059" (1.50mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 150µF Niobium Oxide Capacitor 2.5V 2917 (7343 Metric) 400 mOhm ESR |
| ESR (Equivalent Series Resistance): | 400 mOhm |
| Dissipation Factor: | 6% |
| Beskrivelse: | CAP NIOB OXI 150UF 20% 2.5V 2917 |
| Nuværende - Lækage: | 7.5µA |
| kapacitans: | 150µF |
| Email: | [email protected] |
Relaterede dele til NOJX157M002RWJ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NOSY337M002R0100 | AVX Corporation | CAP NIOB OXI 330UF 20% 2.5V 2917 | Forespørgsel |
 |
NOJB107M001RWJ | AVX Corporation | CAP NIOB OXI 100UF 20% 1.8V 1210 | Forespørgsel |
|
NOJX107M004RWJ | AVX Corporation | CAP NIOB OXIDE 100UF 20% 4V 2917 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers