Købe NP8P128AE3TSM60E med BYCHPS
Køb med garanti
NP8P128AE3TSM60E
- Varenummer:
- NP8P128AE3TSM60E
- Fabrikant:
- Micron Technology
- Beskrivelse:
- IC PCM 128MBIT 135NS 56TSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19200 Pieces
- Datablad:
- NP8P128AE3TSM60E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NP8P128AE3TSM60E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NP8P128AE3TSM60E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 56-TSOP (18.4x14) |
| Fart: | 135ns |
| Serie: | Omneo™ |
| Emballage: | Tray |
| Pakke / tilfælde: | 56-TFSOP (0.724", 18.40mm Width) |
| Driftstemperatur: | -30°C ~ 85°C (TC) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 128Mb (16M x 8) |
| Hukommelsesformat: | PCM (PRAM) |
| Producentens varenummer: | NP8P128AE3TSM60E |
| grænseflade: | SPI/Parallel |
| Beskrivelse: | IC PCM 128MBIT 135NS 56TSOP |
| Email: | [email protected] |
Relaterede dele til NP8P128AE3TSM60E
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NP8P128A13TSM60E | Micron Technology Inc. | IC PCM 128MBIT 115NS 56TSOP | Forespørgsel |
 |
NP8P128AE3T1760E | Micron Technology Inc. | IC PCM 128MBIT 135NS 64EASYBGA | Forespørgsel |
 |
NP8P128A13B1760E | Micron Technology Inc. | IC PCM 128MBIT 115NS 64EASYBGA | Forespørgsel |
|
NP8P128AE3B1760E | Micron Technology Inc. | IC PCM 128MBIT 135NS 64EASYBGA | Forespørgsel |
|
NP8P128A13T1760E | Micron Technology Inc. | IC PCM 128MBIT 115NS 64EASYBGA | Forespørgsel |
|
NP8P128AE3BSM60E | Micron Technology Inc. | IC PCM 128MBIT 135NS 56TSOP | Forespørgsel |
|
NP8P128A13BSM60E | Micron Technology Inc. | IC PCM 128MBIT 115NS 56TSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog