Købe NSVMUN5314DW1T3G med BYCHPS
Køb med garanti
NSVMUN5314DW1T3G
- Varenummer:
- NSVMUN5314DW1T3G
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- TRANS NPN/PNP 50V BIPO SC88-6
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17375 Pieces
- Datablad:
- NSVMUN5314DW1T3G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NSVMUN5314DW1T3G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NSVMUN5314DW1T3G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 50V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 250mV @ 300µA, 10mA |
| Transistor Type: | 1 NPN, 1 PNP - Pre-Biased (Dual) |
| Leverandør Device Package: | SC-88/SC70-6/SOT-363 |
| Serie: | - |
| Modstand - Emitterbase (R2) (Ohm): | 47k |
| Modstand - Base (R1) (Ohms): | 10k |
| Strøm - Max: | 250mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 6-TSSOP, SC-88, SOT-363 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | NSVMUN5314DW1T3G |
| Frekvens - Overgang: | - |
| Udvidet beskrivelse: | Pre-Biased Bipolar Transistor (BJT) 1 NPN, 1 PNP - Pre-Biased (Dual) 50V 100mA 250mW Surface Mount SC-88/SC70-6/SOT-363 |
| Beskrivelse: | TRANS NPN/PNP 50V BIPO SC88-6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 80 @ 5mA, 10V |
| Nuværende - Collector Cutoff (Max): | 500nA |
| Nuværende - Samler (Ic) (Max): | 100mA |
| Email: | [email protected] |
Relaterede dele til NSVMUN5314DW1T3G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers