Købe OR3T306BA256-DB med BYCHPS
Køb med garanti
OR3T306BA256-DB
- Varenummer:
- OR3T306BA256-DB
- Fabrikant:
- Lattice Semiconductor
- Beskrivelse:
- IC FPGA 221 I/O 256BGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15816 Pieces
- Datablad:
- OR3T306BA256-DB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for OR3T306BA256-DB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til OR3T306BA256-DB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Samlet RAM-bit: | 25600 |
| Leverandør Device Package: | 256-BGA (17x17) |
| Serie: | ORCA® 3 |
| Pakke / tilfælde: | 256-BGA |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antal logiske elementer / celler: | 1568 |
| Antal I / O: | 221 |
| Antal porte: | 48000 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | OR3T306BA256-DB |
| Beskrivelse: | IC FPGA 221 I/O 256BGA |
| Email: | [email protected] |
Relaterede dele til OR3T306BA256-DB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
OR3T306BA256I-DB | Lattice Semiconductor Corporation | IC FPGA 221 I/O 256BGA | Forespørgsel |
|
OR3T307S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
 |
LCMXO2-7000ZE-2BG332C | Lattice Semiconductor Corporation | IC FPGA 278 I/O 332CABGA | Forespørgsel |
|
OR3T306S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
 |
A40MX04-2PLG84I | Microsemi Corporation | IC FPGA 69 I/O 84PLCC | Forespørgsel |
|
OR3T307BA256-DB | Lattice Semiconductor Corporation | IC FPGA 221 I/O 256BGA | Forespørgsel |
 |
EP4CE6E22I8L | Altera | IC FPGA 91 I/O 144EQFP | Forespørgsel |
|
OR3T306S208I-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
 |
EP2AGX95DF25C4N | Altera | IC FPGA 260 I/O 572FBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers