Købe OR3T556BA256I-DB med BYCHPS
Køb med garanti
OR3T556BA256I-DB
- Varenummer:
- OR3T556BA256I-DB
- Fabrikant:
- Lattice Semiconductor
- Beskrivelse:
- IC FPGA 223 I/O 256BGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 19864 Pieces
- Datablad:
- OR3T556BA256I-DB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for OR3T556BA256I-DB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til OR3T556BA256I-DB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Samlet RAM-bit: | 43008 |
| Leverandør Device Package: | 256-BGA (17x17) |
| Serie: | ORCA® 3 |
| Pakke / tilfælde: | 256-BGA |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal logiske elementer / celler: | 2592 |
| Antal I / O: | 223 |
| Antal porte: | 80000 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | OR3T556BA256I-DB |
| Beskrivelse: | IC FPGA 223 I/O 256BGA |
| Email: | [email protected] |
Relaterede dele til OR3T556BA256I-DB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
OR3T556BA256-DB | Lattice Semiconductor Corporation | IC FPGA 223 I/O 256BGA | Forespørgsel |
|
OR3T557BA256-DB | Lattice Semiconductor Corporation | IC FPGA 223 I/O 256BGA | Forespørgsel |
|
OR3T556S208I-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
|
OR3T557S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
|
OR3T556S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørgsel |
 |
LFE5U-85F-8BG381I | Lattice Semiconductor Corporation | IC FPGA 205 I/O 381CABGA | Forespørgsel |
 |
XC5VLX155-2FFG1760C | Xilinx Inc. | IC FPGA 800 I/O 1760FBGA | Forespørgsel |
 |
EP20K1000CF672C7 | Altera | IC FPGA 508 I/O 672FBGA | Forespørgsel |
|
XC5VLX110T-2FF1738C | Xilinx Inc. | IC FPGA 680 I/O 1738FCBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers