Købe PAC300002709FAC000 med BYCHPS
Køb med garanti
PAC300002709FAC000
- Varenummer:
- PAC300002709FAC000
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- RES 27 OHM 3W 1% AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18604 Pieces
- Datablad:
- PAC300002709FAC000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PAC300002709FAC000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PAC300002709FAC000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±1% |
|---|---|
| Temperaturkoefficient: | ±100ppm/°C |
| Leverandør Device Package: | Axial |
| Størrelse / Dimension: | 0.217" Dia x 0.650" L (5.50mm x 16.50mm) |
| Serie: | PAC |
| Modstand (ohm): | 27 |
| Power (Watts): | 3W |
| Emballage: | Tape & Box (TB) |
| Pakke / tilfælde: | Axial |
| Andre navne: | 2306 327 12709 2306 327 12709BC 230632712709 230632712709BC PAC03D27R00F PAC3D27.0TB PAC3D27.0TB-ND PPC3D27.0TB |
| Driftstemperatur: | -55°C ~ 275°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | PAC300002709FAC000 |
| Højde - Siddende (Max): | - |
| Funktioner: | Flame Retardant Coating, Pulse Withstanding, Safety |
| Fejlrate: | - |
| Udvidet beskrivelse: | 27 Ohm ±1% 3W Through Hole Resistor Axial Flame Retardant Coating, Pulse Withstanding, Safety Wirewound |
| Beskrivelse: | RES 27 OHM 3W 1% AXIAL |
| Sammensætning: | Wirewound |
| Email: | [email protected] |
Relaterede dele til PAC300002709FAC000
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers