Købe PAS0815LS2R5105 med BYCHPS
Køb med garanti
PAS0815LS2R5105
- Varenummer:
- PAS0815LS2R5105
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- CAP 1F 20% 2.5V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13399 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for PAS0815LS2R5105, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PAS0815LS2R5105 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.5V |
|---|---|
| Tolerance: | ±20% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.315" Dia (8.00mm) |
| Serie: | LS |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 587-3464 587-3464-1 587-3464-1-ND CP PAS0815LS2R5105 |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | PAS0815LS2R5105 |
| Levetid @ Temp.: | - |
| Blyafstand: | 0.138" (3.50mm) |
| Højde - Siddende (Max): | 0.669" (17.00mm) |
| Udvidet beskrivelse: | 1F ±20%(EDLC) Supercapacitor 2.5V Radial, Can 70 mOhm |
| ESR (Equivalent Series Resistance): | 70 mOhm |
| Beskrivelse: | CAP 1F 20% 2.5V THROUGH HOLE |
| kapacitans: | 1F |
| Email: | [email protected] |
Relaterede dele til PAS0815LS2R5105
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PAS0815LA2R3185 | Taiyo Yuden | CAP 1.8F 20% 2.3V THROUGH HOLE | Forespørgsel |
 |
PAS0815LR2R3105 | Taiyo Yuden | CAP 1F 20% 2.3V THROUGH HOLE | Forespørgsel |
 |
PAS0815LN2R7205 | Taiyo Yuden | CAP 2F 20% 2.7V THROUGH HOLE | Forespørgsel |
 |
TV1325-3R0156-R | Eaton | CAP, 3.0V, 15F | Forespørgsel |
 |
706DCR2R3SKY | Illinois Capacitor | CAP 70F -20%, +50% 2.3V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers