Købe PGA400QRHHTEP med BYCHPS
Køb med garanti
PGA400QRHHTEP
- Varenummer:
- PGA400QRHHTEP
- Fabrikant:
- Beskrivelse:
- IC PRESSURE SENSOR SC 36VQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13572 Pieces
- Datablad:
- PGA400QRHHTEP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PGA400QRHHTEP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PGA400QRHHTEP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Pressure Sensor |
|---|---|
| Leverandør Device Package: | 36-VQFN (6x6) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 36-VFQFN Exposed Pad |
| Output Type: | - |
| Andre navne: | 296-43854-2 PGA400QRHHTEP-ND |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | PGA400QRHHTEP |
| grænseflade: | 1-Wire®, SPI |
| Input Type: | - |
| Beskrivelse: | IC PRESSURE SENSOR SC 36VQFN |
| Nuværende - Forsyning: | 13.6mA |
| Email: | [email protected] |
Relaterede dele til PGA400QRHHTEP
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AD694AQ | Analog Devices Inc. | IC SGNL COND 4-20MA TX 16-CDIP | Forespørgsel |
 |
TDC-GP2 T&R 1K | ams | ULTRASONIC FLOW SENSOR 32QFN | Forespørgsel |
|
PGA400QYZSRQ1 | Texas Instruments | IC SENSOR SIGNAL COND 36DSBGA | Forespørgsel |
|
AD80066KRSZ | Analog Devices Inc. | IC DSP CTLR 16BIT 28SSOP | Forespørgsel |
 |
AD9977BBCZRL | Analog Devices Inc. | IC CCDSP DUAL 14BIT 84CSBGA | Forespørgsel |
 |
MAX31855KASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL SOIC | Forespørgsel |
|
PGA400QRHHRQ1 | Texas Instruments | IC PRESSURE SENSOR 5V 36VQFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers