Købe PMC0603-301 med BYCHPS
Køb med garanti
PMC0603-301
- Varenummer:
- PMC0603-301
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- FERRITE BEAD 300 OHM 0603 1LN
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 14949 Pieces
- Datablad:
- PMC0603-301.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PMC0603-301, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PMC0603-301 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Størrelse / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
|---|---|
| Serie: | PMC |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0603 (1608 Metric) |
| Andre navne: | PMC0603301 |
| Driftstemperatur: | -55°C ~ 125°C |
| Antal linjer: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | PMC0603-301 |
| Impedans @ Frekvens: | 300 Ohm @ 100MHz |
| Højde (Max): | 0.031" (0.80mm) |
| Filter Type: | - |
| Beskrivelse: | FERRITE BEAD 300 OHM 0603 1LN |
| DC-modstand (DCR) (Max): | 600 mOhm |
| Nuværende vurdering (Max): | 100mA |
| Email: | [email protected] |
Relaterede dele til PMC0603-301
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PMC0603-152 | Bourns Inc. | FERRITE BEAD 1.5 KOHM 0603 1LN | Forespørgsel |
|
PMC0603-101 | Bourns Inc. | FERRITE BEAD 100 OHM 0603 1LN | Forespørgsel |
|
PMC0603-151 | Bourns Inc. | FERRITE BEAD 150 OHM 0603 1LN | Forespørgsel |
|
PMC0603-300 | Bourns Inc. | FERRITE BEAD 30 OHM 0603 1LN | Forespørgsel |
|
PMC0603-202 | Bourns Inc. | FERRITE BEAD 2 KOHM 0603 1LN | Forespørgsel |
|
PMC0603-102 | Bourns Inc. | FERRITE BEAD 1 KOHM 0603 1LN | Forespørgsel |
|
PMC0603-601 | Bourns Inc. | FERRITE BEAD 600 OHM 0603 1LN | Forespørgsel |
|
PMC0603-600 | Bourns Inc. | FERRITE BEAD 60 OHM 0603 1LN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers