Købe PTGL14AR3R3M3B71B0 med BYCHPS
Køb med garanti
PTGL14AR3R3M3B71B0
- Varenummer:
- PTGL14AR3R3M3B71B0
- Fabrikant:
- Murata Electronics
- Beskrivelse:
- THERMISTOR PTC 56V 3.3 OHM 120C
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14142 Pieces
- Datablad:
- PTGL14AR3R3M3B71B0.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PTGL14AR3R3M3B71B0, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PTGL14AR3R3M3B71B0 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Maks: | 56V |
|---|---|
| Type: | Ceramic |
| Tid til tur: | - |
| Tykkelse (Max): | - |
| Størrelse / Dimension: | 0.571" Dia x 0.157" W (14.50mm x 4.00mm) |
| Serie: | POSISTOR®, PTGL |
| Modstand - Post Trip (R1) (Max): | - |
| Modstand - Initial (Ri) (Min): | - |
| Modstand - 25 ° C (Typ): | 3.3 Ohm |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Disc |
| Driftstemperatur: | -10°C ~ 60°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | PTGL14AR3R3M3B71B0 |
| Blyafstand: | 0.295" (7.50mm) |
| Højde - Siddende (Max): | 0.807" (20.50mm) |
| Udvidet beskrivelse: | PTC Resettable Fuse 56V Ih Through Hole Radial, Disc |
| Beskrivelse: | THERMISTOR PTC 56V 3.3 OHM 120C |
| Nuværende - tur (it): | 830mA |
| Nuværende - Maks: | 2.5A |
| Nuværende - Hold (Ih) (Max): | 490mA |
| Godkendelser: | - |
| Email: | [email protected] |
Relaterede dele til PTGL14AR3R3M3B71B0
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers