Købe RACF324DJT5K60 med BYCHPS
Køb med garanti
RACF324DJT5K60
- Varenummer:
- RACF324DJT5K60
- Fabrikant:
- Stackpole Electronics, Inc.
- Beskrivelse:
- RES ARRAY 4 RES 5.6K OHM 2010
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12973 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for RACF324DJT5K60, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RACF324DJT5K60 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±5% |
|---|---|
| Temperaturkoefficient: | ±200ppm/°C |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.200" L x 0.118" W (5.08mm x 3.00mm) |
| Serie: | RACF |
| Modstand (ohm): | 5.6k |
| Strøm pr. Element: | 125mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2010 (5025 Metric), Concave, Long Side Terminals |
| Andre navne: | RAC 324D 5.6K 5% R RAC324D5.6K5%R RAC324D5.6K5%R-ND RAC324D5.6KJR RAC324D5.6KJR-ND |
| Driftstemperatur: | -55°C ~ 125°C |
| Antal modstande: | 4 |
| Antal stifter: | 8 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | RACF324DJT5K60 |
| Højde - Siddende (Max): | 0.028" (0.70mm) |
| Udvidet beskrivelse: | 5.6k Ohm ±5% 125mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 2010 (5025 Metric), Concave, Long Side Terminals |
| Beskrivelse: | RES ARRAY 4 RES 5.6K OHM 2010 |
| Kredsløbstype: | Isolated |
| Applikationer: | - |
| Email: | [email protected] |
Relaterede dele til RACF324DJT5K60
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers