Købe RAVF164DGT330R med BYCHPS
Køb med garanti
RAVF164DGT330R
- Varenummer:
- RAVF164DGT330R
- Fabrikant:
- Stackpole Electronics, Inc.
- Beskrivelse:
- RES ARRAY 4 RES 330 OHM 1206
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14886 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for RAVF164DGT330R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RAVF164DGT330R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±2% |
|---|---|
| Temperaturkoefficient: | ±200ppm/°C |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | RAVF |
| Modstand (ohm): | 330 |
| Strøm pr. Element: | 62.5mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1206 (3216 Metric), Convex, Long Side Terminals |
| Andre navne: | RAV 164D 330 2% R RAV164D3302%R RAV164D3302%R-ND RAV164D330GR RAV164D330GR-ND |
| Driftstemperatur: | -55°C ~ 155°C |
| Antal modstande: | 4 |
| Antal stifter: | 8 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | RAVF164DGT330R |
| Højde - Siddende (Max): | 0.024" (0.60mm) |
| Udvidet beskrivelse: | 330 Ohm ±2% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals |
| Beskrivelse: | RES ARRAY 4 RES 330 OHM 1206 |
| Kredsløbstype: | Isolated |
| Applikationer: | Automotive AEC-Q200 |
| Email: | [email protected] |
Relaterede dele til RAVF164DGT330R
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers