Købe RHS125P73BPZBH3887 med BYCHPS
Køb med garanti
RHS125P73BPZBH3887
- Varenummer:
- RHS125P73BPZBH3887
- Fabrikant:
- Draloric / Vishay
- Beskrivelse:
- CAP CER 125PF
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 13776 Pieces
- Datablad:
- RHS125P73BPZBH3887.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for RHS125P73BPZBH3887, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RHS125P73BPZBH3887 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | RHS |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | RHS125P73BPZBH3887 |
| Udvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP CER 125PF |
| Email: | [email protected] |
Relaterede dele til RHS125P73BPZBH3887
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
1812Y0250271KFT | Knowles Syfer | CAP CER 270PF 25V C0G/NP0 1812 | Forespørgsel |
 |
RHS125P73BPZAH3271 | Vishay Beyschlag | CAP CER 125PF | Forespørgsel |
|
RHS125P73BPZAK4815 | Vishay Beyschlag | CAP CER 125PF | Forespørgsel |
|
1825J2K50220GCR | Knowles Syfer | CAP CER 1825 | Forespørgsel |
|
1812J1000183JAR | Knowles Syfer | CAP CER 1812 | Forespørgsel |
|
1812Y1000562GCR | Knowles Syfer | CAP CER 1812 | Forespørgsel |
|
2220Y3K00682MXR | Knowles Syfer | CAP CER 2220 | Forespørgsel |
|
1210J0630151FAR | Knowles Syfer | CAP CER 1210 | Forespørgsel |
 |
AQ147M120FAJME | AVX Corporation | CAP CER 12PF 500V 1111 | Forespørgsel |
 |
VJ0402Y121MXBAC | Vishay Vitramon | CAP CER 120PF 100V X7R 0402 | Forespørgsel |
|
1812J0500471FAR | Knowles Syfer | CAP CER 1812 | Forespørgsel |
 |
VJ2225A473KBAAT4X | Vishay Vitramon | CAP CER 0.047UF 50V C0G/NP0 2225 | Forespørgsel |
|
2225Y2000152JCR | Knowles Syfer | CAP CER 2225 | Forespørgsel |
|
2225J0630271KCT | Knowles Syfer | CAP CER 2225 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers