Købe RLD30P900UF med BYCHPS
Køb med garanti
RLD30P900UF
- Varenummer:
- RLD30P900UF
- Fabrikant:
- Littelfuse
- Beskrivelse:
- FUSE RESETTABLE 9A 30V RADIAL
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12661 Pieces
- Datablad:
- RLD30P900UF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for RLD30P900UF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RLD30P900UF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Maks: | 30V |
|---|---|
| Type: | Polymeric |
| Tid til tur: | 20s |
| Tykkelse (Max): | - |
| Størrelse / Dimension: | 0.949" L x 0.118" W (24.10mm x 3.00mm) |
| Serie: | POLY-FUSE®, RLD30 |
| Modstand - Post Trip (R1) (Max): | 20 mOhm |
| Modstand - Initial (Ri) (Min): | 5 mOhm |
| Modstand - 25 ° C (Typ): | - |
| Vurderinger: | - |
| Emballage: | Tape & Box (TB) |
| Pakke / tilfælde: | Radial, Disc |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | RLD30P900UF |
| Blyafstand: | 0.402" (10.20mm) |
| Højde - Siddende (Max): | 1.169" (29.70mm) |
| Udvidet beskrivelse: | PTC Resettable Fuse 30V Ih Through Hole Radial, Disc |
| Beskrivelse: | FUSE RESETTABLE 9A 30V RADIAL |
| Nuværende - tur (it): | 18A |
| Nuværende - Maks: | 40A |
| Nuværende - Hold (Ih) (Max): | 9A |
| Godkendelser: | cURus, TUV |
| Email: | [email protected] |
Relaterede dele til RLD30P900UF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog