Købe RM732T30 med BYCHPS
Køb med garanti
RM732T30
- Varenummer:
- RM732T30
- Beskrivelse:
- RELAY GEN PURPOSE 3PDT 16A 230V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12249 Pieces
- Datablad:
- RM732T30.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for RM732T30, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RM732T30 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 184 VAC |
|---|---|
| Sluk spænding (Min): | 69 VAC |
| Afslutningsstil: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Skiftespænding: | 440VAC - Max |
| Serie: | RM, SCHRACK |
| Relæ Type: | General Purpose |
| Emballage: | Tray |
| Andre navne: | 9-1393107-1 |
| Driftstemperatur: | -45°C ~ 50°C |
| Monteringstype: | Socketable |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | RM732T30 |
| Funktioner: | LED Indicator, Mechanical Indicator, Test Button |
| Udvidet beskrivelse: | General Purpose Relay 3PDT (3 Form C) 230VAC Coil Socketable |
| Beskrivelse: | RELAY GEN PURPOSE 3PDT 16A 230V |
| Kontakt Rating (Aktuel): | 16A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontaktformular: | 3PDT (3 Form C) |
| Spole spænding: | 230VAC |
| Spole type: | Non Latching |
| Coil Resistance: | 7.5 kOhms |
| Coil Power: | 2.7 VA |
| Email: | [email protected] |
Relaterede dele til RM732T30
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers