Købe RSBDC3100AA00J med BYCHPS
Køb med garanti
RSBDC3100AA00J
- Varenummer:
- RSBDC3100AA00J
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP FILM 0.1UF 5% 63VDC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12669 Pieces
- Datablad:
- RSBDC3100AA00J.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for RSBDC3100AA00J, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til RSBDC3100AA00J via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 63V |
|---|---|
| Spændingsbedømmelse - AC: | 40V |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.283" L x 0.098" W (7.20mm x 2.50mm) |
| Serie: | RSB |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 399-6044 SBDC3100AA00J |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | RSBDC3100AA00J |
| Blyafstand: | 0.197" (5.00mm) |
| Højde - Siddende (Max): | 0.260" (6.60mm) |
| Funktioner: | High Temperature |
| Udvidet beskrivelse: | 0.1µF ±5% Film Capacitor 40V 63V Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked |
| Beskrivelse: | CAP FILM 0.1UF 5% 63VDC RADIAL |
| kapacitans: | 0.1µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til RSBDC3100AA00J
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers