Købe S501LF357V2R7A med BYCHPS
Køb med garanti
S501LF357V2R7A
- Varenummer:
- S501LF357V2R7A
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP 350F -5% +10% 2.7V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18253 Pieces
- Datablad:
- S501LF357V2R7A.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for S501LF357V2R7A, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til S501LF357V2R7A via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | -5%, +10% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 1.378" Dia (35.00mm) |
| Serie: | S501 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Andre navne: | 399-11546 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | S501LF357V2R7A |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Blyafstand: | 0.394" (10.00mm) |
| Højde - Siddende (Max): | 2.400" (61.00mm) |
| Udvidet beskrivelse: | 350F -5%, +10%(EDLC) Supercapacitor 2.7V Radial, Can - Snap-In 3.1 mOhm @ 1kHz 1000 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 3.1 mOhm @ 1kHz |
| Beskrivelse: | CAP 350F -5% +10% 2.7V T/H |
| kapacitans: | 350F |
| Email: | [email protected] |
Relaterede dele til S501LF357V2R7A
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
KSL-3R3703E-R | Eaton | CAP 70MF -20% +80% 3.3V SMD | Forespørgsel |
 |
ESHSR-0010C0-002R7 | NessCap Co Ltd | CAP 10F -10% +20% 2.7V T/H | Forespørgsel |
 |
B0820-2R5225-R | Eaton | CAP 2.2F -20% +80% 2.5V T/H | Forespørgsel |
 |
FCS0H104ZFTBR24 | KEMET | CAP 100MF -20% +80% 5.5V SMD | Forespørgsel |
 |
A1635-2R5475-R | Eaton | CAP 4.7F -20% +80% 2.5V T/H | Forespørgsel |
 |
PA-5R0V474-R | Eaton | CAP 470MF -20% +80% 5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers