Købe SCCV60B107MRB med BYCHPS
Køb med garanti
SCCV60B107MRB
- Varenummer:
- SCCV60B107MRB
- Fabrikant:
- AVX Corporation
- Beskrivelse:
- CAP 100F 20% 2.7V THRU HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15175 Pieces
- Datablad:
- SCCV60B107MRB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SCCV60B107MRB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SCCV60B107MRB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | ±20% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.709" Dia (18.00mm) |
| Serie: | SCC |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 478-10022 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 3 Weeks |
| Producentens varenummer: | SCCV60B107MRB |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Blyafstand: | 0.315" (8.00mm) |
| Højde - Siddende (Max): | 2.441" (62.00mm) |
| Udvidet beskrivelse: | 100F ±20%(EDLC) Supercapacitor 2.7V Radial, Can 15 mOhm @ 1MHz 1000 Hrs @ 60°C |
| ESR (Equivalent Series Resistance): | 15 mOhm @ 1MHz |
| Beskrivelse: | CAP 100F 20% 2.7V THRU HOLE |
| kapacitans: | 100F |
| Email: | [email protected] |
Relaterede dele til SCCV60B107MRB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SCMR22C155MRBA0 | AVX Corporation | CAPACITOR 1.5F 20% 5V THRU HOLE | Forespørgsel |
 |
PHV-5R4H474-R | Eaton | CAP 470MF -10% +30% 5.4V T/H | Forespørgsel |
 |
MAL219691106E3 | Vishay BC Components | CAP ALUM 4F 8.4V SNAP | Forespørgsel |
 |
PB-5R0V104 | Eaton | CAP 100MF -20% +80% 5V T/H | Forespørgsel |
 |
JJL0E557MSEC | Nichicon | CAP 550F 20% 2.5V CHASSIS MOUNT | Forespørgsel |
 |
PM-5R0V305-R | Eaton | CAP 3F -20% +80% 5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers