Købe SCRN243R-F med BYCHPS
Køb med garanti
SCRN243R-F
- Varenummer:
- SCRN243R-F
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP FILM 3UF 10% 1.5KVPK SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13602 Pieces
- Datablad:
- SCRN243R-F.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SCRN243R-F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SCRN243R-F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 1500Vpk (1.5KVPK) |
| Tolerance: | ±10% |
| Afslutning: | Screw Terminals |
| Størrelse / Dimension: | 2.910" L x 1.910" W (73.91mm x 48.51mm), Lip |
| Serie: | SCR |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 338-4167 SCRN243R-F-ND |
| Driftstemperatur: | -40°C ~ 80°C |
| Monteringstype: | Chassis Mount, Requires Holder/Bracket |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | SCRN243R-F |
| Blyafstand: | 1.380" (35.05mm) |
| Højde - Siddende (Max): | 4.310" (109.47mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 3µF ±10% Film Capacitor 1500Vpk (1.5KVPK) Paper, Metallized Radial, Can |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Paper, Metallized |
| Beskrivelse: | CAP FILM 3UF 10% 1.5KVPK SCREW |
| kapacitans: | 3µF |
| Applikationer: | Commutation; High Frequency, Switching; High Pulse, DV/DT |
| Email: | [email protected] |
Relaterede dele til SCRN243R-F
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers