Købe SE70PJHM3_A/I med BYCHPS
Køb med garanti
SE70PJHM3_A/I
- Varenummer:
- SE70PJHM3_A/I
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE GEN PURP 600V 2.9A TO277A
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19268 Pieces
- Datablad:
- SE70PJHM3_A/I.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SE70PJHM3_A/I, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SE70PJHM3_A/I via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.05V @ 7A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 600V |
| Leverandør Device Package: | TO-277A (SMPC) |
| Fart: | Standard Recovery >500ns, > 200mA (Io) |
| Serie: | Automotive, AEC-Q101, eSMP® |
| Reverse Recovery Time (trr): | 2.6µs |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-277, 3-PowerDFN |
| Driftstemperatur - Junction: | -55°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 36 Weeks |
| Producentens varenummer: | SE70PJHM3_A/I |
| Udvidet beskrivelse: | Diode Standard 600V 2.9A Surface Mount TO-277A (SMPC) |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 600V 2.9A TO277A |
| Nuværende - Reverse Lækage @ Vr: | 20µA @ 600V |
| Nuværende - Gennemsnitlig Rectified (Io): | 2.9A |
| Kapacitans @ Vr, F: | 76pF @ 4V, 1MHz |
| Email: | [email protected] |
Relaterede dele til SE70PJHM3_A/I
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog