Købe SG350Q med BYCHPS
Køb med garanti
SG350Q
- Varenummer:
- SG350Q
- Fabrikant:
- Littelfuse
- Beskrivelse:
- GDT 350V 1KA SURFACE MOUNT
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15284 Pieces
- Datablad:
- SG350Q.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SG350Q, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SG350Q via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - DC Spark Over (Nom): | 350V |
|---|---|
| Tolerance: | - |
| Serie: | SG |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1812 (4532 Metric) |
| Andre navne: | F4132TR |
| Antal polakker: | 2 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | SG350Q |
| Impulsudladningstrøm (8 / 20μs): | 1000A (1kA) |
| Fejl kort: | No |
| Udvidet beskrivelse: | Gas Discharge Tube 1000A (1kA) 2 Pole Surface Mount |
| Beskrivelse: | GDT 350V 1KA SURFACE MOUNT |
| Email: | [email protected] |
Relaterede dele til SG350Q
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2036-60-B3FLF | Bourns Inc. | GDT 600V 20% 10KA T/H FAIL SHORT | Forespørgsel |
 |
B88069X7050B502 | EPCOS (TDK) | T25-A250X | Forespørgsel |
 |
T049246 | Bourns Inc. | GAS DISCHARGE TUBE | Forespørgsel |
 |
2036-23-C9F | Bourns Inc. | GDT 230V 20% 10KA T/H FAIL SHORT | Forespørgsel |
|
2039-80-BT1LF | Bourns Inc. | GDT 800V 20% 2.5KA THROUGH HOLE | Forespørgsel |
 |
2026-15-C | Bourns Inc. | GDT 150V 20% 20KA THROUGH HOLE | Forespørgsel |
 |
GTCS35-750M-R05-2 | Littelfuse Inc. | GDT 75V 20% 5KA SURFACE MOUNT | Forespørgsel |
 |
2027-23-ALF | Bourns Inc. | GDT 230V 15% 10KA | Forespørgsel |
 |
SG350 | Littelfuse Inc. | GDT 350V 1KA SURFACE MOUNT | Forespørgsel |
 |
B88069X6881T902 | EPCOS (TDK) | GDT 230V 20% 5KA SURFACE MOUNT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers