Købe SI2304DS,215 med BYCHPS
Køb med garanti
SI2304DS,215
- Varenummer:
- SI2304DS,215
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- MOSFET N-CH 30V 1.7A SOT23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16747 Pieces
- Datablad:
- SI2304DS,215.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SI2304DS,215, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SI2304DS,215 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2V @ 1mA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TO-236AB (SOT23) |
| Serie: | TrenchMOS™ |
| Rds On (Max) @ Id, Vgs: | 117 mOhm @ 500mA, 10V |
| Power Dissipation (Max): | 830mW (Tc) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | 568-5957-2 934056633215 SI2304DS T/R SI2304DS T/R-ND SI2304DS,215-ND |
| Driftstemperatur: | -65°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SI2304DS,215 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 195pF @ 10V |
| Gate Charge (Qg) (Max) @ Vgs: | 4.6nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 30V 1.7A (Tc) 830mW (Tc) Surface Mount TO-236AB (SOT23) |
| Afløb til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET N-CH 30V 1.7A SOT23 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 1.7A (Tc) |
| Email: | [email protected] |
Relaterede dele til SI2304DS,215
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers