Købe SLPX272M180H9P3 med BYCHPS
Køb med garanti
SLPX272M180H9P3
- Varenummer:
- SLPX272M180H9P3
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP ALUM 2700UF 20% 180V SNAP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17377 Pieces
- Datablad:
- SLPX272M180H9P3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SLPX272M180H9P3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SLPX272M180H9P3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 180V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 1.378" Dia (35.00mm) |
| Serie: | SLPX |
| Ripple Current: | 5.3A |
| Polarisering: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Andre navne: | 338-1602 SLPX272M180H9P3-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 21 Weeks |
| Producentens varenummer: | SLPX272M180H9P3 |
| Levetid @ Temp.: | 3000 Hrs @ 85°C |
| Blyafstand: | 0.394" (10.00mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 1.969" (50.00mm) |
| Udvidet beskrivelse: | 2700µF 180V Aluminum Capacitors Radial, Can - Snap-In 74 mOhm 3000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 74 mOhm |
| Beskrivelse: | CAP ALUM 2700UF 20% 180V SNAP |
| kapacitans: | 2700µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til SLPX272M180H9P3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers