Købe SM102033004F med BYCHPS
Køb med garanti
SM102033004F
- Varenummer:
- SM102033004F
- Fabrikant:
- Ohmite
- Beskrivelse:
- RES 3M OHM 1W 1% RADIAL
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15633 Pieces
- Datablad:
- SM102033004F.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SM102033004F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SM102033004F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±1% |
|---|---|
| Temperaturkoefficient: | - |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.580" L x 0.100" W (14.73mm x 2.54mm) |
| Serie: | Slim-Mox |
| Modstand (ohm): | 3M |
| Power (Watts): | 1W |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | SM102F-3M |
| Driftstemperatur: | -55°C ~ 110°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SM102033004F |
| Højde - Siddende (Max): | 0.340" (8.64mm) |
| Funktioner: | Non-Inductive |
| Fejlrate: | - |
| Udvidet beskrivelse: | 3M Ohm ±1% 1W Through Hole Resistor Radial Non-Inductive Thick Film |
| Beskrivelse: | RES 3M OHM 1W 1% RADIAL |
| Sammensætning: | Thick Film |
| Email: | [email protected] |
Relaterede dele til SM102033004F
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SM102033005F | Ohmite | RES 30M OHM 1W 1% RADIAL | Forespørgsel |
|
SM102033004FE | Ohmite | RES 3M OHM 1W 1% RADIAL | Forespørgsel |
|
SM102033003FE | Ohmite | RES 300K OHM 1W 1% RADIAL | Forespørgsel |
|
SM102033006FE | Ohmite | RES 300M OHM 1W 1% RADIAL | Forespørgsel |
|
SM102031001JE | Ohmite | RES 1K OHM 1W 5% RADIAL | Forespørgsel |
|
SM102033007FE | Ohmite | RES 3G OHM 1W 1% RADIAL | Forespørgsel |
|
SM102033005FE | Ohmite | RES 30M OHM 1W 1% RADIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers