Købe SMBT2222AE6327HTSA1 med BYCHPS
Køb med garanti
SMBT2222AE6327HTSA1
- Varenummer:
- SMBT2222AE6327HTSA1
- Beskrivelse:
- TRANS NPN 40V 0.6A SOT-23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17259 Pieces
- Datablad:
- SMBT2222AE6327HTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SMBT2222AE6327HTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SMBT2222AE6327HTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 40V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 1V @ 50mA, 500mA |
| Transistor Type: | NPN |
| Leverandør Device Package: | PG-SOT23-3 |
| Serie: | - |
| Strøm - Max: | 330mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | SMBT 2222A E6327 SMBT2222A SMBT2222AE6327 SMBT2222AE6327BTSA1 SMBT2222AE6327XT SMBT2222AINTR SMBT2222AINTR-ND SMBT2222AXTINTR SMBT2222AXTINTR-ND SP000011176 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SMBT2222AE6327HTSA1 |
| Frekvens - Overgang: | 300MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor NPN 40V 600mA 300MHz 330mW Surface Mount PG-SOT23-3 |
| Beskrivelse: | TRANS NPN 40V 0.6A SOT-23 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 100 @ 150mA, 10V |
| Nuværende - Collector Cutoff (Max): | 10nA (ICBO) |
| Nuværende - Samler (Ic) (Max): | 600mA |
| Email: | [email protected] |
Relaterede dele til SMBT2222AE6327HTSA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers