Købe SMR15104J400B10L16.5CBULK med BYCHPS
Køb med garanti
SMR15104J400B10L16.5CBULK
- Varenummer:
- SMR15104J400B10L16.5CBULK
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP FILM 0.1UF 5% 400VDC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19539 Pieces
- Datablad:
- SMR15104J400B10L16.5CBULK.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SMR15104J400B10L16.5CBULK, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SMR15104J400B10L16.5CBULK via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 400V |
|---|---|
| Spændingsbedømmelse - AC: | 200V |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.709" L x 0.256" W (18.00mm x 6.50mm) |
| Serie: | SMR |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 399-13030 F211BJ104(1)400(2) |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | SMR15104J400B10L16.5CBULK |
| Blyafstand: | 0.591" (15.00mm) |
| Højde - Siddende (Max): | 0.492" (12.50mm) |
| Funktioner: | High Temperature |
| Udvidet beskrivelse: | 0.1µF ±5% Film Capacitor 200V 400V Polyphenylene Sulfide (PPS), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyphenylene Sulfide (PPS), Metallized |
| Beskrivelse: | CAP FILM 0.1UF 5% 400VDC RADIAL |
| kapacitans: | 0.1µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til SMR15104J400B10L16.5CBULK
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers