Købe SN74SSTEB32866ZWLR med BYCHPS
Køb med garanti
SN74SSTEB32866ZWLR
- Varenummer:
- SN74SSTEB32866ZWLR
- Fabrikant:
- Beskrivelse:
- IC BUFF CONFIG REG 25BIT 96BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14101 Pieces
- Datablad:
- SN74SSTEB32866ZWLR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SN74SSTEB32866ZWLR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SN74SSTEB32866ZWLR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 1.425 V ~ 1.575 V |
|---|---|
| Leverandør Device Package: | 96-PBGA (13.6x5.6) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 96-LFBGA |
| Andre navne: | 296-24513-2 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal bitter: | 25 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 2 (1 Year) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | SN74SSTEB32866ZWLR |
| Logik Type: | Configurable Buffer with Address-Parity Test |
| Udvidet beskrivelse: | Configurable Buffer with Address-Parity Test IC 96-PBGA (13.6x5.6) |
| Beskrivelse: | IC BUFF CONFIG REG 25BIT 96BGA |
| Email: | [email protected] |
Relaterede dele til SN74SSTEB32866ZWLR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
SN74ACT1073DW | Texas Instruments | IC 16-BIT BUS TERM ARRAY 20-SOIC | Forespørgsel |
|
SN74ABT8652DWRG4 | Texas Instruments | IC SCAN TEST DEVICE 28SOIC | Forespørgsel |
 |
74AUP1Z04GF,132 | Nexperia USA Inc. | IC XTAL DRIVER LP 6-XSON | Forespørgsel |
|
CSSTV32867SGKEREP | Texas Instruments | IC REGISTERED BUFF 26BIT 96LFBGA | Forespørgsel |
 |
ISL55100AIRZ-T | Intersil | IC COMP DRVR/WINDOW 18V 72-QFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers