Købe SPB03N60C3ATMA1 med BYCHPS
Køb med garanti
SPB03N60C3ATMA1
- Varenummer:
- SPB03N60C3ATMA1
- Beskrivelse:
- MOSFET N-CH 650V 3.2A D2PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18275 Pieces
- Datablad:
- SPB03N60C3ATMA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SPB03N60C3ATMA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SPB03N60C3ATMA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3.9V @ 135µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | PG-TO263-3-2 |
| Serie: | CoolMOS™ |
| Rds On (Max) @ Id, Vgs: | 1.4 Ohm @ 2A, 10V |
| Power Dissipation (Max): | 38W (Tc) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Andre navne: | SP000013517 SPB03N60C3 SPB03N60C3INTR SPB03N60C3INTR-ND SPB03N60C3XT SPB03N60C3XTINTR SPB03N60C3XTINTR-ND |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SPB03N60C3ATMA1 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 400pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 17nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 650V 3.2A (Tc) 38W (Tc) Surface Mount PG-TO263-3-2 |
| Afløb til Source Voltage (VDSS): | 650V |
| Beskrivelse: | MOSFET N-CH 650V 3.2A D2PAK |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 3.2A (Tc) |
| Email: | [email protected] |
Relaterede dele til SPB03N60C3ATMA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers