Købe SPW52N50C3 med BYCHPS
Køb med garanti
SPW52N50C3
- Varenummer:
- SPW52N50C3
- Beskrivelse:
- MOSFET N-CH 560V 52A TO-247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14850 Pieces
- Datablad:
- SPW52N50C3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SPW52N50C3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SPW52N50C3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3.9V @ 2.7mA |
|---|---|
| Vgs (Max): | ±20V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | PG-TO247-3 |
| Serie: | CoolMOS™ |
| Rds On (Max) @ Id, Vgs: | 70 mOhm @ 30A, 10V |
| Power Dissipation (Max): | 417W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | SP000014626 SPW52N50C3-ND SPW52N50C3FKSA1 SPW52N50C3IN SPW52N50C3X SPW52N50C3XK |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | SPW52N50C3 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 6800pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 290nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 560V 52A (Tc) 417W (Tc) Through Hole PG-TO247-3 |
| Drevspænding (Maks. Rds On, Min Rds On): | 10V |
| Afløb til Source Voltage (VDSS): | 560V |
| Beskrivelse: | MOSFET N-CH 560V 52A TO-247 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 52A (Tc) |
| Email: | [email protected] |
Relaterede dele til SPW52N50C3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers